| US 7,518,379 B2 | ||
| Connection unit, a board for mounting a device under test, a probe card and a device interfacing part | ||
| Kentaro Pukushima, Tokyo (Japan); and Masashi Hoshino, Tokyo (Japan) | ||
| Assigned to Advantest Corp., Tokyo (Japan) | ||
| Filed on Jul. 14, 2006, as Appl. No. 11/487,091. | ||
| Application 11/487091 is a continuation of application No. 10/800189, filed on Mar. 12, 2004, granted, now 7,098,680. | ||
| Application 10/800189 is a continuation of application No. PCT/JP03/13595, filed on Oct. 24, 2003. | ||
| Claims priority of application No. 2002-317287 (JP), filed on Oct. 31, 2002; and application No. 2002-338560 (JP), filed on Nov. 21, 2002. | ||
| Prior Publication US 2007/0024307 A1, Feb. 01, 2007 | ||
| Int. Cl. G01R 27/04 (2006.01); G01R 31/28 (2006.01) | ||
| U.S. Cl. 324—630 [324/158.1] | 11 Claims |
| 1. A DUT mounting board for electrically connecting an electronic device and a testing apparatus for testing said electronic
device, said DUT mounting board comprising:
an IC socket for holding said electronic device,
a socket substrate for holding said IC socket,
a high-frequency signal connector for supplying a test signal from said testing apparatus to said IC socket, and
a low-frequency signal connector, provided farther from said IC socket than a position of said high-frequency signal connector,
for supplying a test signal of which a frequency is lower than said test signal which said high-frequency signal connector
provides from said testing apparatus to said IC socket.
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