| US 7,518,226 B2 | ||
| Integrated circuit packaging system with interposer | ||
| Philip Lyndon Cablao, Singapore (Singapore); Rachel Layda Abinan, Singapore (Singapore); Dario S. Filoteo, Jr., Singapore (Singapore); and Allan P. Ilagan, Singapore (Singapore) | ||
| Assigned to Stats Chippac Ltd., Singapore (Singapore) | ||
| Filed on Feb. 06, 2007, as Appl. No. 11/671,684. | ||
| Prior Publication US 2008/0185719 A1, Aug. 07, 2008 | ||
| Int. Cl. H01L 23/538 (2006.01) | ||
| U.S. Cl. 257—686 [257/724] | 12 Claims |
| 7. An integrated circuit packaging system comprising:
an enhanced ball grid array substrate having a signal trace in a step;
an integrated circuit mounted adjacent to the step;
an interposer having a coupling slot;
an upper die on the interposer;
the interposer over the integrated and the step;
the integrated circuit coupled to the upper die through the coupling slot; and
the integrated circuit electrically connected to the signal trace through the interposer.
|