| US 7,518,222 B2 | ||
| Apparatus and system for an IC substrate, socket, and assembly | ||
| Xiaoqing Ma, Gilbert, Ariz. (US); King Gonzalez, Gilbert, Ariz. (US); Stewart Ongchin, Phoenix, Ariz. (US); Stephen Tisdale, Gilbert, Ariz. (US); and Vadim Sherman, Scottsdale, Ariz. (US) | ||
| Assigned to Intel Corporation, Santa Clara, Calif. (US) | ||
| Filed on Mar. 30, 2006, as Appl. No. 11/394,855. | ||
| Prior Publication US 2007/0228531 A1, Oct. 04, 2007 | ||
| Int. Cl. H01L 23/02 (2006.01) | ||
| U.S. Cl. 257—678 [257/686; 257/737; 361/735; 361/760] | 17 Claims |
| 1. An apparatus, comprising:
a substrate having a plurality of through-holes therethrough; and
an integrated circuit (IC) socket frame to mount to the substrate, the IC socket frame comprising:
a socket frame body; and
a plurality of beam features, each of the plurality of beam features located at spaced apart discrete locations on the socket
frame body without a connecting sidewall between the plurality of beam features, extending from the socket frame body, and
corresponding in arrangement to the plurality of through-holes through the substrate, wherein at least one of the plurality
of beam features includes an orientation feature to orientate the substrate to the IC socket frame.
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