| US 7,518,220 B2 | ||
| Substrate for an FBGA semiconductor component | ||
| Steffen Kroehnert, Dresden (Germany); Knut Kahlisch, Dresden (Germany); and Wieland Wahrmund, Dresden (Germany) | ||
| Assigned to Infineon Technologies AG, Munich (Germany) | ||
| Filed on Jan. 24, 2006, as Appl. No. 11/338,867. | ||
| Claims priority of application No. 10 2005 003 390 (DE), filed on Jan. 24, 2005. | ||
| Prior Publication US 2006/0180929 A1, Aug. 17, 2006 | ||
| Int. Cl. H01L 23/495 (2006.01) | ||
| U.S. Cl. 257—676 [257/787] | 16 Claims |
| 1. A semiconductor component comprising:
a substrate having a chip side, a solder ball side, and a bonding channel;
a semiconductor chip mounted on the chip side of the substrate;
a plurality of solder ball pads disposed on the solder ball side of the substrate;
a plurality of electrical connections extending through the bonding channel and electrically connected between the semiconductor
chip and the solder ball pads; and
an encapsulation material covering the electrical connections within the bonding channel, wherein the encapsulation material
extends within a surface of the substrate, and wherein the surface of the substrate includes at least one depression on the
solder ball side adjacent the bonding channel, the encapsulation material extending within the depressions, wherein the at
least one depression comprises at least one groove running around the bonding channel.
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