| US 7,517,733 B2 | ||
| Leadframe design for QFN package with top terminal leads | ||
| Zigmund R. Camacho, Singapore (Singapore); Henry D. Bathan, Singapore (Singapore); Jose Alvin Santos Caparas, Singapore (Singapore); and Lionel Chien Hui Tay, Singapore (Singapore) | ||
| Assigned to STATS ChipPAC, Ltd., Singapore (Singapore) | ||
| Filed on Mar. 22, 2007, as Appl. No. 11/689,645. | ||
| Prior Publication US 2008/0230876 A1, Sep. 25, 2008 | ||
| Int. Cl. H01L 21/44 (2006.01); H01L 21/48 (2006.01) | ||
| U.S. Cl. 438—123 [438/127] | 22 Claims |
| 1. A method of fabricating a leadframe for a semiconductor package, comprising:
providing a lead finger electrically connected to a conductive bar, the lead finger having a substantially flat first surface;
bending the lead finger to form a lower portion and a substantially vertical portion;
bending the substantially vertical portion of the lead finger to form a top lead structure extending over the lower portion
of the lead finger so that a portion of the first surface of the lead finger constituting the top lead structure is disposed
opposite a second portion of the first surface of the lead finger constituting the lower portion, and the top lead structure
is aligned parallel to the lower portion of the lead finger; connecting a second lead finger to the lead finger and the conductive
bar to serve as a lower terminal lead structure for the semiconductor package, and
forming a raised electrical interconnect structure on a surface of the top lead structure.
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