| US 7,517,636 B2 | ||
| Photosensitive resin composition, photosensitive element, production method of resist pattern and production method for printed circuit board | ||
| Takahiro Fukaya, Hitachinaka (Japan); Masaki Endou, Ibaraki-ken (Japan); Takuji Abe, Hitachi (Japan); and Katsutoshi Itagaki, Hitachi (Japan) | ||
| Assigned to Hitachi Chemical Co., Ltd., Tokyo (Japan) | ||
| Appl. No. 10/296,911 PCT Filed May 29, 2001, PCT No. PCT/JP01/04496 § 371(c)(1), (2), (4) Date May 28, 2003, PCT Pub. No. WO01/92958, PCT Pub. Date Dec. 06, 2001. |
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| Claims priority of application No. 2000-157530 (JP), filed on May 29, 2000; and application No. 2000-395193 (JP), filed on Dec. 26, 2000. | ||
| Prior Publication US 2003/0186166 A1, Oct. 02, 2003 | ||
| Int. Cl. G03F 7/028 (2006.01); G03F 7/032 (2006.01); G03F 7/20 (2006.01); G03F 7/30 (2006.01); G03F 7/36 (2006.01) | ||
| U.S. Cl. 430—285.1 [430/920; 430/271.1; 430/325; 430/311; 430/313; 430/319] | 13 Claims |
1. A photosensitive resin composition comprising (A) a binder polymer having a weight average molecular weight of from 30,000
to 70,000, (B) a photopolymerizable compound and (C) a photopolymerization initiator, wherein component (B) contains a polyalkylene
glycol di(meth)acrylate having both an ethylene glycol chain and a propylene glycol chain in its molecule, which polyalkylene
glycol di(meth)acrylate comprises 15 or more alkylene glycol units each having 2 to 6 carbon atoms, and component (C) contains
an acridine-based compound represented by general formula (II):
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