| US 7,517,429 B2 | ||
| Plasma treatment apparatus | ||
| Chun-Sik Kim, Sungnam (Korea, Republic of) | ||
| Assigned to Advanced Display Process Engineering Co., Ltd., Sungnam-shi (Korea, Republic of) | ||
| Filed on Apr. 03, 2007, as Appl. No. 11/730,595. | ||
| Claims priority of application No. 10-2006-0030540 (KR), filed on Apr. 04, 2006. | ||
| Prior Publication US 2007/0227660 A1, Oct. 04, 2007 | ||
| Int. Cl. C23F 1/00 (2006.01); H01L 21/306 (2006.01) | ||
| U.S. Cl. 156—345.29 | 14 Claims |
| 1. A plasma treatment apparatus, comprising:
a chamber; and
at least one of an intake or exhaust portion, comprising:
at least one body having a wall that extends upward into an interior space of the chamber from a bottom surface of the chamber
such that an outer surface of the wall is exposed to the interior space of the chamber; the wall having an inner diameter
that is increased upwardly and an opening formed at an upper end of the wall; and
at least one through hole that extends through the wall across a thickness thereof, spaced apart from the bottom surface of
the chamber and the opening at the upper end of the wall, so as to discharge particles accumulated in a bottom portion of
the chamber during an exhaust process.
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