| US 7,517,140 B2 | ||
| Techniques for precision testing of thermal interface materials | ||
| Joseph A. Cervantes, Mountain View, Calif. (US); Sridhar V. Machiroutu, Fremont, Calif. (US); Shawn McEuen, Portland, Oreg. (US); Joshua T. Linden-Levy, Portland, Oreg. (US); and Robert W. Wolcott, Newberg, Oreg. (US) | ||
| Assigned to Intel Corporation, Santa Clara, Calif. (US) | ||
| Filed on Sep. 27, 2006, as Appl. No. 11/535,915. | ||
| Prior Publication US 2008/0075137 A1, Mar. 27, 2008 | ||
| Int. Cl. G01K 3/00 (2006.01); G01N 25/00 (2006.01) | ||
| U.S. Cl. 374—7 [374/184; 374/166; 374/112; 374/29] | 17 Claims |
| 1. An apparatus, comprising:
a hot anvil and a cold anvil each having multiple sensors disposed along its axis;
a thermal interface material disposed between said anvils;
an inductive sensor disposed on one of said anvils to perform bond line thickness measurements; and
a control module to communicatively couple to said sensors, said control module arranged to receive temperature readings from
said multiple sensors to form a temperature gradient, determine a surface temperature for each anvil based on said temperature
gradient, determine a heat flux through said thermal interface material based on said surface temperature, and determine a
resistance value for said thermal interface material based on said heat flux.
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