| US 7,516,661 B2 | ||
| Z offset MEMS device | ||
| Jonathan L. Klein, Redmond, Wash. (US); Galen P. Magendanz, Issaquah, Wash. (US); Peter H. LaFond, Redmond, Wash. (US); Mark L. Williams, Seattle, Wash. (US); and Michael J. Foster, Issaquah, Wash. (US) | ||
| Assigned to Honeywell International Inc., Morristown, N.J. (US) | ||
| Filed on Feb. 23, 2006, as Appl. No. 11/360,870. | ||
| Prior Publication US 2007/0193380 A1, Aug. 23, 2007 | ||
| Int. Cl. G01P 15/00 (2006.01); G01P 15/125 (2006.01) | ||
| U.S. Cl. 73—514.32 [73/514.01] | 12 Claims |
| 1. A microelectromechanical (MEMS) device comprising:
a microelectromechanical mechanism layer comprising:
a first part; and
a second part located on a first plane; and
at least one cover permanently attached to the mechanism layer for sealing at least a portion of the mechanism layer, the
at least one cover comprising:
an inner surface;
an outer surface; and
a structure protruding from the inner surface of the at least one cover, the structure configured to permanently mechanically
deflect the first part into a second planes,
wherein the first part and the second part include a comb structure.
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