| US 7,515,435 B2 | ||
| Multi-functional composite substrate structure | ||
| Uei-Ming Jow, Hsinchu (Taiwan); Chang-Sheng Chen, Hsinchu (Taiwan); Chin-Sun Shyu, Hsinchu (Taiwan); Min-Lin Lee, Hsinchu (Taiwan); Shinn-Juh Lay, Hsinchu (Taiwan); and Ying-Jiunn Lai, Hsinchu (Taiwan) | ||
| Assigned to Industrial Technology Research Institute, Hsinchu (Taiwan) | ||
| Filed on Dec. 28, 2006, as Appl. No. 11/646,339. | ||
| Claims priority of application No. 95101511 A (TW), filed on Jan. 13, 2006. | ||
| Prior Publication US 2007/0164396 A1, Jul. 19, 2007 | ||
| Int. Cl. H05K 1/16 (2006.01) | ||
| U.S. Cl. 361—766 [361/312; 361/313; 361/760; 361/761; 361/762; 361/763; 174/250; 174/255; 174/256; 174/258; 174/260] | 21 Claims |
| 1. A multi-functional composite substrate structure, comprising:
a first substrate, the first substrate having a top surface and a bottom surface;
a second substrate, disposed on the top surface of the first substrate;
a third substrate, disposed on the bottom surface of the first substrate, the dielectric constant of the third substrate lower
than the dielectric constant of the first substrate; the dielectric constant of the third substrate higher than the dielectric
constant of the second substrate, the dielectric loss of the third substrate higher than the dielectric constant of the second
substrate; and
two signal transmission circuits, the signal transmission circuits disposed on a side of the second substrate opposite to
the first substrate and a side of the third substrate opposite to the first substrate, respectively, each of the signal transmission
circuits having a specific system impedance and the system impedances of the signal transmission circuits being different
from each other.
|