| US 7,515,425 B2 | ||
| Electronic device and cooling unit | ||
| Nagahisa Chikazawa, Kawasaki (Japan); and Katsumi Adachi, Kato (Japan) | ||
| Assigned to Fujitsu Limited, Kawasaki (Japan) | ||
| Filed on Apr. 20, 2007, as Appl. No. 11/785,888. | ||
| Claims priority of application No. 2006-265959 (JP), filed on Sep. 28, 2006. | ||
| Prior Publication US 2008/0080145 A1, Apr. 03, 2008 | ||
| Int. Cl. H05K 7/20 (2006.01) | ||
| U.S. Cl. 361—719 [361/687; 165/104.33; 165/185; 174/252] | 8 Claims |
| 1. An electronic apparatus having a cooling unit comprising:
a housing having an opening for air cooling;
a substrate having a first surface and a second surface, each mounted with a heat generating component, the substrate being
fixed in the housing; and
the cooling unit further comprising:
a first heat transfer component that extends along the first surface so as to contact the heat generating component mounted
on the first surface, the first heat transfer component transferring heat from the heat generating component mounted on the
first surface of the substrate to an area near the opening, and
a second heat transfer component extending along the second surface so as to contact the heat generating component mounted
on the second surface, and fastened to the first heat transfer component by a fastener such that the substrate is sandwiched
between the second heat transfer component and the first heat transfer component, the second heat transfer component being
configured to transfer heat from the heat generating component mounted on the second surface of the substrate to the first
heat transfer component by way of the fastener, thereby transferring the heat from the heat generating component mounted on
the second surface to the first heat transfer component and transferring the heat to the area near the opening.
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