| US 7,514,788 B2 | ||
| Structure of mounting electronic component | ||
| Kenji Kobae, Kawasaki (Japan); Hidehiko Kira, Kawasaki (Japan); Norio Kainuma, Kawasaki (Japan); and Takayoshi Matsumura, Kawasaki (Japan) | ||
| Assigned to Fujitsu Limited, Tokyo (Japan) | ||
| Filed on Oct. 31, 2007, as Appl. No. 11/979,165. | ||
| Application 11/979165 is a division of application No. 11/041292, filed on Jan. 25, 2005, granted, now 7,355,285. | ||
| Claims priority of application No. 2004-316499 (JP), filed on Oct. 29, 2004. | ||
| Prior Publication US 2008/0061435 A1, Mar. 13, 2008 | ||
| Int. Cl. H01L 21/302 (2006.01) | ||
| U.S. Cl. 257—738 [257/737; 257/778; 257/E21.508; 257/E23.021; 438/120; 438/108; 438/613] | 1 Claim |
| 1. A structure of mounting an electronic part on a circuit board, wherein
bumps of said electronic part are respectively flip-chip-bonded to electrodes of said circuit board by applying ultrasonic
vibrations to the electronic part,
said electronic part further includes positioning bumps, whose diameters are larger than those of the bumps and whose projecting
lengths are longer than those of the bumps,
said circuit board further includes pads, on which the positioning bumps of said electronic part are respectively bonded,
and
an array direction of the positioning bumps is perpendicular to a direction of the ultrasonic vibrations.
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