| US 7,514,784 B2 | ||
| Electronic circuit device and production method of the same | ||
| Takuya Mayuzumi, Tokyo (Japan); Masahiro Sasaki, Tokyo (Japan); and Kiyoomi Kadoya, Tokyo (Japan) | ||
| Assigned to Hitachi, Ltd., Tokyo (Japan) | ||
| Filed on Aug. 09, 2005, as Appl. No. 11/199,177. | ||
| Claims priority of application No. 2004-364824 (JP), filed on Dec. 16, 2004. | ||
| Prior Publication US 2006/0134937 A1, Jun. 22, 2006 | ||
| Int. Cl. H01L 23/34 (2006.01) | ||
| U.S. Cl. 257—712 [257/706; 257/707; 257/713; 257/717; 361/704; 361/707; 361/719; 361/717; 361/712] | 14 Claims |
| 1. An electronic circuit device comprising: a circuit board mounting an electronic component; a resin-molded portion that covers the electronic component; a convex connector having at least one metal connection terminal and extending outside the resin-molded portion; and an elastic sealing member wrapped around the resin-molded portion and pressed again a wall portion of the concave portion for sealing the at least one metal terminal. |