| US 7,514,771 B2 | ||
| Leadless lead-frame | ||
| Chao-Ming Tseng, Kaohsiung County (Taiwan) | ||
| Assigned to Advanced Semiconductor Engineering, Inc., Kaoshiung (Taiwan) | ||
| Filed on Feb. 12, 2007, as Appl. No. 11/704,997. | ||
| Application 11/704997 is a continuation of application No. 10/876458, filed on Jun. 28, 2004, granted, now 7,193,302. | ||
| Claims priority of application No. 92137725 A (TW), filed on Dec. 31, 2003. | ||
| Prior Publication US 2007/0164406 A1, Jul. 19, 2007 | ||
| This patent is subject to a terminal disclaimer. | ||
| Int. Cl. H01L 23/02 (2006.01) | ||
| U.S. Cl. 257—678 | 12 Claims |
| 1. A leadless lead-frame comprising:
a chip paddle having chip disposal areas, and a grounding area surrounding the chip disposal area, wherein the grounding area
having a recession with a recession-bottom and a recession-wall connecting to the recession-bottom, an angle is formed between
the recession-wall and the recession-bottom and the angle is less than 90 degrees; and
a plurality of leads surrounding the chip paddle, the chip paddle having a cavity and the cavity having a cavity-bottom serving
as the chip disposal area, and the depth of the cavity is equal to half of the thickness of the chip paddle.
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