| US 7,514,756 B2 | ||
| Semiconductor device with MISFET | ||
| Amane Oishi, Kamakura (Japan) | ||
| Assigned to Kabushiki Kaisha Toshiba, Tokyo (Japan) | ||
| Filed on Jul. 07, 2006, as Appl. No. 11/482,120. | ||
| Claims priority of application No. 2005-327583 (JP), filed on Nov. 11, 2005. | ||
| Prior Publication US 2007/0108471 A1, May 17, 2007 | ||
| Int. Cl. H01L 29/76 (2006.01) | ||
| U.S. Cl. 257—382 [257/288; 257/343; 257/584; 257/E21.048; 257/E21.063; 257/E21.432; 257/E21.507; 257/E21.669] | 12 Claims |

| 1. A semiconductor device, comprising:
a substrate;
a semiconductor region provided in the substrate;
a group of transistors including a plurality of metal insulator semiconductor (MIS) transistors and provided in the semiconductor
region, the MIS transistors including a plurality of gate electrodes which extend in a first direction and are provided on
the semiconductor region via gate insulation films; an insulation film provided on the group of transistors; and
a first contact layer and a second contact layer extending in the first direction and provided on the semiconductor region
at opposite sides of the group of transistors, each of the first contact layer and the second contact layer having a rectangular
planar configuration, wherein the first and second contact layers have a length substantially equal to a channel width of
the MIS transistors.
|