US 7,514,656 B2
Method for the construction of an induction hob, as well as an induction hob
Thomas Haag, Oberhausen-Rheinhausen (Germany)
Assigned to E.G.O. Elektro-Geraetebau GmbH, Oberderdingen (Germany)
Filed on Jan. 30, 2008, as Appl. No. 12/22,440.
Claims priority of application No. 10 2007 006 280 (DE), filed on Jan. 31, 2007.
Prior Publication US 2008/0179316 A1, Jul. 31, 2008
Int. Cl. H05B 6/12 (2006.01)
U.S. Cl. 219—622  [219/624; 219/647; 219/662; 219/443.1] 17 Claims
OG exemplary drawing
 
1. A method for the construction of an induction hob, said induction hob comprising an inductor support plate having an opening, a plurality of inductors and a receptacle for a control mechanism and power electronics wherein said control mechanism controls said plurality of inductors and said power electronics provides power to said plurality of inductors, said receptacle having positioned thereon a printed circuit board comprising a plurality of respective connecting devices for said induction hob, comprising the steps of:
attaching said plurality of inductors on a first side of said inductor support plate in a respective predetermined position such that a space is defined between said inductors, wherein each of said inductors comprise a respective connecting cable for connection to said control mechanism and said power electronics via said plurality of respective connecting devices, wherein said respective connecting cable passes through said opening in said inductor support plate, wherein said opening is centrally positioned in said space between said inductors;
attaching said receptacle for said control mechanism and power electronics on a second side of said inductor support plate wherein at least a portion of said printed circuit board is positioned in said opening such that said respective connective devices are located at said opening;
passing said respective connecting cable through said opening in said inductor support plate; and
connecting said respective connecting cable to said control mechanism and said power electronics via said respective connective devices.