| US 7,514,637 B1 | ||
| Electroplating solution, method for fabricating multilayer printed wiring board using the solution, and multilayer printed wiring board | ||
| Honchin En, Gifu (Japan) | ||
| Assigned to Ibiden Co., Ltd., Gifu (Japan) | ||
| Appl. No. 10/48,852 PCT Filed Jul. 04, 2000, PCT No. PCT/JP00/04418 § 371(c)(1), (2), (4) Date Apr. 11, 2002, PCT Pub. No. WO01/11932, PCT Pub. Date Feb. 15, 2001. |
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| Claims priority of application No. 11/224143 (JP), filed on Aug. 06, 1999; application No. 2000/156877 (JP), filed on May 26, 2000; application No. 2000/156878 (JP), filed on May 26, 2000; application No. 2000/194619 (JP), filed on Jun. 28, 2000; and application No. 2000/194620 (JP), filed on Jun. 28, 2000. | ||
| Int. Cl. H05K 1/03 (2006.01); H05K 1/09 (2006.01) | ||
| U.S. Cl. 174—256 [174/257; 174/262; 29/846] | 10 Claims |
| 1. A method for manufacturing a multilayer printed circuit board of the present invention, characterized by containing at
least the following processes (a) to (e):
(a) a process of forming a resin insulating layer having an opening part for a via-hole by exposure and development treatment
or laser treatment;
(b) a process of forming a metal layer comprising at least one element selected from the group consisting of Cu, Ni, P, Pd,
Co and W on the surface of the resin insulating layer and the opening part for a via-hole;
(c) a process of forming a plating resist on said metal layer;
(d) a process of forming an electroplating film on a part un-coated with said plating resist using an electroplating solution
containing: 50 to 300 g/L of copper sulfate, 30 to 200 g/L of sulfuric acid, 25 to 90 mg/L of chlorine ion, and 1 to 1000
mg/L of an additive comprising at least a leveling agent and a brightener; and
(e) a process of forming a conductor circuit by etching the metal layer existing under said plating resist after said plating
resist is separated.
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