| 1. A method for manufacturing a memory device, comprising:
forming an electrode layer having a top surface, the electrode layer comprising two first electrodes, a shared second electrode
arranged between the two first electrodes, and insulating members separating the shared second electrode from the two first
electrodes, and wherein the two first electrodes, the shared second electrode, and the insulating members extend to the top
surface of the electrode layer, and the insulating members have respective widths between the shared second electrode and
the two first electrodes at the top surface; and
forming a first and a second bridge of memory material on the top surface of the electrode layer across respective insulating
members, the first and second bridges respectively comprising a patch of memory material contacting a corresponding first
electrode and the shared second electrode to define an inter-electrode current path through the respective bridge between
the corresponding first electrode and the shared second electrode having a path length defined by the width of the corresponding
insulating member, wherein the memory material has at least two solid phases.
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