| US 7,514,206 B2 | ||
| Thermally developable materials with buried conductive backside coatings | ||
| Thomas J. Ludemann, Maplewood, Minn. (US); Gary E. LaBelle, Stillwater, Minn. (US); Thomas J. Kub, North Stillwater, Minn. (US); Kumars Sakizadeh, Woodbury, Minn. (US); and Sharon M. Simpson, Lake Elmo, Minn. (US) | ||
| Assigned to Carestream Health, Inc., Rochester, N.Y. (US) | ||
| Filed on Apr. 13, 2006, as Appl. No. 11/403,782. | ||
| Prior Publication US 2007/0244004 A1, Oct. 18, 2007 | ||
| This patent is subject to a terminal disclaimer. | ||
| Int. Cl. G03C 5/16 (2006.01); G03C 1/498 (2006.01) | ||
| U.S. Cl. 430—523 [430/510; 430/527; 430/530; 430/619; 430/531] | 23 Claims |
| 1. A thermally developable material that comprises a support having on the frontside thereof, one or more thermally developable
imaging layers comprising a binder and in reactive association, a non-photosensitive source of reducible silver ions, and
a reducing agent composition for said non-photo-sensitive source reducible silver ions, and
having disposed on the backside of said support,
an organic solvent-based buried conductive backside layer comprising one or more binder polymers having dispersed therein,
nanoparticles of a conductive metal compound and an antistatic compound that is an organic solvent soluble inorganic alkali
metal salt that together are present in an amount sufficient to provide a water electrode resistivity of 1012 ohm/sq at 21.1° C. and 50% relative humidity, and a static decay time of less than 100 seconds at 21.1° C. and 20% relative
humidity,
and an organic solvent-based outermost backside layer.
|