	US 7,514,021 B2
	Conductive resin film, collector and production methods therefore
Michinari Miyagawa, Nagahama (Japan); and Takashi Imai, Nagahama (Japan)
Assigned to Mitsubishi Plastics, Inc., Tokyo (Japan)
Appl. No. 10/519,339 PCT Filed Jun. 24, 2003, PCT No. PCT/JP03/07961 § 371(c)(1), (2), (4) Date Aug. 15, 2005, PCT Pub. No. WO04/001772, PCT Pub. Date Dec. 31, 2003.
Claims priority of application No. 2002-182444 (JP), filed on Jun. 24, 2002; application No. 2002-286799 (JP), filed on Sep. 30, 2002; and application No. 2002-341121 (JP), filed on Nov. 25, 2002.
Prior Publication US 2006/0098382 A1, May 11, 2006
Int. Cl. H01B 1/00 (2006.01)

U.S. Cl. 252—500 [361/502; 428/215; 428/195.1; 428/211.1; 428/400; 430/58.05; 399/159]

8 Claims

1. A conductive resin film constituted by laminated layers comprising:

a conductive substrate layer;

a low-resistance layer with a volume resistance of 0.1 to 1.0 Ωcm in a thickness direction as at least one of its outermost layer;

each layer of the laminated layers being made of a thermoplastic resin and a conductive agent,

wherein the substrate layer comprises a conductive agent selected from the group consisting of graphite powder, exfoliated graphite, carbon black, carbon fiber, carbon nanofiber, carbon nanotube, a metal carbide, a metal nitride, a metal oxide, metal fiber and metal powder;

wherein the conductive substrate layer and the low-resistance layer comprise a thermoplastic resin selected from the group consisting of polyolefin resins, polyolefin elastomers, amorphous polyolefin resins, polystyrene resins, hydrogenated styrene elastomers, polyvinyl chloride resins, polyvinylidene chloride resins, (meth)acrylate, (meth)acrylic resins, polyetherimide resins, polysulphone resins, polyethersulphone resin, polyamide imide resins, polyalylate resins, fluororesins and fluoro-elastomers;

wherein a volume resistance of the low-resistance layer in a thickness direction is ⅕ or less of a volume resistance of the substrate layer in a thickness direction, and a volume resistance of the conductive resin film as a whole in a thickness direction is 0.01 to 5 Ωcm; and

wherein the low-resistance layer is a layer in which the thermoplastic resin comrprises a fine carbon fiber with a fiber diameter of 0.003 to 0.5 μm and a fiber length of 0.1 to 100 μm as a conductive agent.