| US 7,513,966 B2 | ||
| Apparatus for manufacturing bonded substrate | ||
| Koji Hashizume, Kasugai (Japan); Yoshimasa Miyajima, Kasugai (Japan); Norihiko Hatano, Kasugai (Japan); and Tetsuji Kadowaki, Kasugai (Japan) | ||
| Assigned to Fujitsu Limited, Kawasaki (Japan) | ||
| Filed on May 05, 2006, as Appl. No. 11/429,523. | ||
| Application 11/248741 is a division of application No. 09/998054, filed on Nov. 30, 2001, granted, now 7,096,911. | ||
| Application 11/429523 is a continuation of application No. 11/248741, filed on Oct. 12, 2005, granted, now 7,300,532. | ||
| Claims priority of application No. 2000-364582 (JP), filed on Nov. 30, 2000; and application No. 2001-350166 (JP), filed on Nov. 15, 2001. | ||
| Prior Publication US 2006/0201617 A1, Sep. 14, 2006 | ||
| Int. Cl. B32B 41/00 (2006.01) | ||
| U.S. Cl. 156—64 [156/358; 156/359; 156/360; 156/378; 156/379] | 13 Claims |
| 1. A hardening device for hardening a seal material of a bonded substrate, wherein the bonded substrate is prepared by bonding
a first substrate and a second substrate with the seal material and the seal material includes a photo-curing adhesive, the
hardening device comprising:
a transport device for transporting the bonded substrate;
a light source for irradiating light to harden the seal material in the bonded substrate supported by the transport device;
a sensor, arranged in the transport device, for detecting intensity of the light to which the bonded substrate is exposed;
and
an adjustment unit for adjusting the intensity of the light to which the bonded substrate is exposed based on the detection
by the sensor, wherein the adjustment unit adjusts a position of one of the light source and the transport device to maintain
the intensity of the light at a constant level.
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