| US 7,513,686 B2 | ||
| Circuit lid with a thermocouple | ||
| Joseph M. Schaffer, Luling, Tex. (US) | ||
| Assigned to Advanced Micro Devices, Inc., Sunnyvale, Calif. (US) | ||
| Filed on Feb. 27, 2006, as Appl. No. 11/362,749. | ||
| Prior Publication US 2007/0200475 A1, Aug. 30, 2007 | ||
| Int. Cl. G01K 7/00 (2006.01) | ||
| U.S. Cl. 374—180 [374/179] | 36 Claims |
| 1. An apparatus, comprising:
an electronic device;
a lid for positioning on the electronic device; and
a junction of two dissimilar metals associated with the lid wherein a portion of the lid provides one of the two dissimilar
metals, the junction providing a thermocouple to provide an output signal representative of a temperature of the lid.
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