| US 7,513,032 B2 | ||
| Method of mounting an electronic part to a substrate | ||
| Koichi Shimamura, Kawasaki (Japan); and Kazuyuki Ikura, Kawasaki (Japan) | ||
| Assigned to Fujitsu Limited, Kawasaki (Japan) | ||
| Filed on Jan. 19, 2005, as Appl. No. 11/37,266. | ||
| Claims priority of application No. 2004-316407 (JP), filed on Oct. 29, 2004. | ||
| Prior Publication US 2006/0091555 A1, May 04, 2006 | ||
| Int. Cl. H05K 3/30 (2006.01) | ||
| U.S. Cl. 29—740 [29/729; 29/739; 29/840; 228/180.1; 228/180.22] | 2 Claims |
| 1. A method of mounting an electronic part to a substrate, comprising:
a substrate feed transporting step, transporting the substrate supplied to a substrate transport start position to a mounting
device;
an electronic part supplying step, supplying the electronic part to the mounting device;
a mounting step, mounting the electronic part to the substrate by the mounting device; an underfill applying step, applying
an underfill onto the substrate after the mounting step, the underfill being filled between the substrate and the electronic
part, and
a substrate return transporting step, transporting the substrate to a substrate discharge position on which the electronic
part has been mounted in the mounting step,
wherein the substrate is held by a carrier having a heat capacity not lower than a predetermined value,
in the substrate feed transporting step, a heater slider heats the carrier when the carrier is within a predetermined distance
from the substrate transport start position and
in the mounting step, the substrate is heated by a residual heat of the carrier, after being separated from the heater slider.
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