| US 7,512,293 B2 | ||
| Header-replaceable hybrid waveguide sensor | ||
| Soo Jin Jung, Suwon-si (Korea, Republic of); Il Kweon Joung, Ansan-si (Korea, Republic of); Dong Ho Shin, Seoul (Korea, Republic of); Won Hoe Koo, Seoul (Korea, Republic of); and Gwan Su Lee, Suwon-si (Korea, Republic of) | ||
| Assigned to Samsung Electro-Mechanics Co., Ltd., Suwon (Korea, Republic of) | ||
| Filed on Aug. 30, 2007, as Appl. No. 11/896,309. | ||
| Claims priority of application No. 10-2006-0082883 (KR), filed on Aug. 30, 2006. | ||
| Prior Publication US 2008/0056641 A1, Mar. 06, 2008 | ||
| Int. Cl. G02B 6/26 (2006.01) | ||
| U.S. Cl. 385—12 [385/14; 385/49; 385/129; 385/50] | 7 Claims |
| 1. A header-replaceable hybrid waveguide sensor comprising:
a header coupling section including:
a dielectric layer having an optical signal input section and an optical signal output section formed in one end thereof,
the dielectric layer having two lines of protrusions formed on the upper surface thereof; and
a polymer layer formed on and under the dielectric layer; and
a sensor header including:
a dielectric layer having a protrusion formed on the upper surface thereof and a predetermined size of thin metal film provided
therein;
a polymer layer formed on and under the dielectric layer and having an opening formed in a portion corresponding to the thin
metal film, the opening having a larger width than the thin metal film; and
a receptor layer formed on the upper surface of the dielectric layer exposed by the opening.
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