| US 7,511,782 B2 | ||
| Liquid crystal display device and fabrication method having open gate/data pads with transparent conductive layer thereon to an edge thereof | ||
| Kwang Sik Oh, Kyongsangbuk-do (Korea, Republic of); Myung Woo Nam, Kyongsangbuk-do (Korea, Republic of); Ki Du Cho, Kumi-shi (Korea, Republic of); Se Jong Shin, Taegu-kwangyokshi (Korea, Republic of); Bong Chul Kim, Taegu-kwangyokshi (Korea, Republic of); and Kwon Seob Choi, Cheongju-shi (Korea, Republic of) | ||
| Assigned to LG Display Co., Ltd., Seoul (Korea, Republic of) | ||
| Filed on Mar. 29, 2005, as Appl. No. 11/91,477. | ||
| Claims priority of application No. 10-2004-0022625 (KR), filed on Apr. 01, 2004. | ||
| Prior Publication US 2005/0219433 A1, Oct. 06, 2005 | ||
| Int. Cl. G02F 1/1343 (2006.01) | ||
| U.S. Cl. 349—43 [349/46; 349/149] | 20 Claims |

| 1. An LCD device comprising:
a gate line and a gate pad on a substrate;
a gate insulating layer on an entire surface of the substrate including the gate line except the gate pad;
a data line and a data pad on the gate insulating layer;
a thin film transistor at a crossing portion of the gate line and the data line;
a passivation layer on the entire surface of the substrate including the thin film transistor except the gate pad and data
pad;
an overcoat layer on the passivation layer;
a pixel electrode in contact with the thin film transistor through a contact hole formed in the passivation layer and the
overcoat layer;
a first transparent conductive layer directly on an open region of the gate pad to an edge thereof, wherein the first transparent
conductive layer is formed at a region where all the gate insulating layer, the a passivation layer and the overcoat layer
is removed on said open region including to said edge; and
a second transparent conductive layer directly on an open region of the data pad to an edge thereof, wherein the second transparent
conductive layer is formed at a region where all the a passivation layer and the overcoat layer is removed on said open region
including to said edge, wherein a semiconductor layer is below the data pad.
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