| US 7,511,312 B2 | ||
| Surface mounting device-type light emitting diode | ||
| Joon Seok Chae, Seongnam-Si (Korea, Republic of); and Jong Hwan Baek, Seoul (Korea, Republic of) | ||
| Assigned to Samsung Electro-Mechanics Co., Ltd., Suwon-Si, Gyunggi-Do (Korea, Republic of) | ||
| Filed on Apr. 06, 2007, as Appl. No. 11/697,638. | ||
| Claims priority of application No. 10-2006-0070622 (KR), filed on Jul. 27, 2006. | ||
| Prior Publication US 2008/0023714 A1, Jan. 31, 2008 | ||
| Int. Cl. H01L 29/74 (2006.01) | ||
| U.S. Cl. 257—98 [257/99] | 8 Claims |
| 1. A surface mounting device-type light emitting diode (SMD-type LED) comprising:
a package housing one or more pairs of electrodes therein, the package having a predetermined space in the center thereof
and a light-emission window which is opened so that light is emitted through the light-emission window;
a lens formed on the package so as to cover the light-emission window;
an LED chip formed on an electrode inside the package;
a wire for electrically connecting the LED chip and the electrode; and
a phosphor-mixed layer formed on the surface of the lens adjacent to the light-emission window;
wherein the surface of the lens having the phosphor-mixed layer formed thereon is formed with a groove concave toward the
lens with respect to the surface of the light-emission window; and
wherein the concave groove is formed with an inclined surface which is tapered toward the central portion from both ends of
the groove.
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