| US 7,510,911 B2 | ||
| Semiconductor apparatus and method of manufacturing the same | ||
| Taizo Tomioka, Yokohama (Japan); and Kazuo Shimokawa, Yokohama (Japan) | ||
| Assigned to Kabushiki Kaisha Toshiba, Tokyo (Japan) | ||
| Filed on Jun. 25, 2004, as Appl. No. 10/876,016. | ||
| Claims priority of application No. 2003-182454 (JP), filed on Jun. 26, 2003; and application No. 2004-186041 (JP), filed on Jun. 24, 2004. | ||
| Prior Publication US 2005/0029651 A1, Feb. 10, 2005 | ||
| Int. Cl. H01L 21/00 (2006.01); H01L 23/10 (2006.01); H01L 23/34 (2006.01) | ||
| U.S. Cl. 438—122 [257/707] | 9 Claims |
| 1. A semiconductor device comprising:
a plurality of semiconductor chips each having a first surface bonded to a wiring board and being electrically connected thereto;
a plurality of heat radiating members each having a first end portion bonded to a second surface of each of the plurality
of semiconductor chips and having second end portion bonded to the wiring board through solder bumps formed thereon for establishing
an electric connection therebetween;
a first sealing material which seals the plurality of heat radiating members integrally as one body, such that a surface of
the heat radiating members which opposes the surface bonded to the semiconductor chip is externally exposed; and
a second sealing material which seals an outer peripheral portion of the first sealing material, and the semiconductor chips.
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