US 7,510,341 B2
Temperature calibration method for baking processing apparatus, adjustment method for development processing apparatus, and method of manufacturing semiconductor apparatus
Kei Hayasaki, Kamakura (Japan); Daizo Mutoh, Yokohama (Japan); Masafumi Asano, Yokohama (Japan); Tadahito Fujisawa, Tokyo (Japan); Tsuyoshi Shibata, Yokohama (Japan); and Shinichi Ito, Yokohama (Japan)
Assigned to Kabushiki Kaisha Toshiba, Tokyo (Japan)
Filed on Jun. 29, 2004, as Appl. No. 10/878,310.
Claims priority of application No. 2003-188496 (JP), filed on Jun. 30, 2003.
Prior Publication US 2005/0008979 A1, Jan. 13, 2005
Int. Cl. G03D 5/00 (2006.01)
U.S. Cl. 396—611  [355/27] 32 Claims
OG exemplary drawing
 
1. A temperature calibration method for a baking processing apparatus, comprising:
forming a photosensitive resin film onto a substrate;
preparing an exposure mask having a mask pattern for a dose monitor mark to monitor an effective dose on the substrate;
forming a latent image of the dose monitor mark by using an exposure apparatus to transfer the mask pattern for the dose monitor mark onto the photosensitive resin film at a predetermined dose;
preparing baking processing apparatuses;
baking the substrate, on which the latent image is formed, at a predetermined temperature by using each of the baking processing apparatuses;
cooling the baking-processed substrate;
measuring a length of the latent image of the dose monitor mark obtained by a developing process;
determining a relationship between a temperature setting and an effective dose; and
calibrating the temperature setting of each of the baking processing apparatuses to obtain a predetermined effective dose based on the determined relationship and the measured length corresponding to each of the baking processing apparatuses.