| US 7,509,872 B2 | ||
| Stress and strain analysis method and its equipment | ||
| Koji Hyodo, Ibaraki (Japan); Chao-Nan Xu, Saga (Japan); Takashi Yamane, Ibaraki (Japan); Motoyuki Akamatsu, Ibaraki (Japan); Yoshiyuki Yokogawa, Aichi (Japan); and Tetsuya Kameyama, Aichi (Japan) | ||
| Assigned to National Institute of Advanced Industrial Science and Technology, Tokyo (Japan) | ||
| Filed on Jan. 19, 2007, as Appl. No. 11/655,219. | ||
| Claims priority of application No. 2006-011844 (JP), filed on Jan. 20, 2006. | ||
| Prior Publication US 2007/0186674 A1, Aug. 16, 2007 | ||
| Int. Cl. G01N 3/08 (2006.01) | ||
| U.S. Cl. 73—800 [73/826; 356/34] | 8 Claims |
| 1. A stress analysis method, comprising:
measuring a state of a stress which acts on a measurement target object by measuring photobirefringence of a first substance
caused by the stress;
measuring the state of the stress which acts on the measurement target object by measuring light emitted from a second substance
in response to the stress; and
obtaining dynamic information including a stress distribution by arithmetically processing data obtained as a result of the
photoelasticity measurement and data obtained as a result of the mechanoluminescence measurement.
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