| US 7,348,772 B2 | ||
| Printed circuit board having weak magnetic field sensor and method of manufacturing the same | ||
| Myung-Sam Kang, Daejeon (Korea, Republic of); Chang-Sup Ryu, Daejeon (Korea, Republic of); Won-Cheol Bae, Kyunggi-Do (Korea, Republic of); Sang-Duck Kim, Daegu (Korea, Republic of); and Doo-Hwan Lee, Chungcheongbuk-do (Korea, Republic of) | ||
| Assigned to Samsung Electro-Mechanics Co., Ltd, Kyunggi-Do (Korea, Republic of) | ||
| Filed on Oct. 28, 2004, as Appl. No. 10/975,736. | ||
| Claims priority of application No. 10-2004-0058050 (KR), filed on Jul. 24, 2004. | ||
| Prior Publication US 2006/0017435 A1, Jan. 26, 2006 | ||
| This patent is subject to a terminal disclaimer. | ||
| Int. Cl. G01R 33/04 (2006.01) | ||
| U.S. Cl. 324—253 [324/249; 324/260] | 5 Claims |
| 1. A Printed Circuit Board (PCB) having a weak magnetic field sensor, comprising:
a base plate with a first side and a second side, each side being formed with a first excitation circuit and a first detection
circuit;
first and second soft magnetic core bodies laminated on said first side and said second side, respectively, each magnetic
core body being formed of a plurality of soft magnetic cores; and
first and second outer layers laminated on said first and second soft magnetic core bodies, respectively, each of said first
and second outer layers having a second excitation circuit and a second detection circuit, each second excitation and detection
circuit being connected to a respective first excitation circuit and first detection circuit on said base, to surround the
first and second soft magnetic cores, respectively;
wherein the soft magnetic cores, the excitation circuits and the detection circuits formed on the first side of the base plate,
and the soft magnetic cores, the excitation circuits and the detection circuits formed on the second side of the base plate
are perpendicular to each other, respectively.
|