| US 7,348,539 B2 | ||
| Image sensor for semiconductor light-sensing device and image processing apparatus using the same | ||
| Shin Jae Kang, Kyungki-do (Korea, Republic of); Won Tae Choi, Kyungki-do (Korea, Republic of); Joo Yul Ko, Kyungki-do (Korea, Republic of); and Deuk Hee Park, Seoul (Korea, Republic of) | ||
| Assigned to Samsung Electro-Mechanics Co., Ltd., Kyungki-Do (Korea, Republic of) | ||
| Filed on Mar. 24, 2006, as Appl. No. 11/387,696. | ||
| Claims priority of application No. 10-2005-0044149 (KR), filed on May 25, 2005. | ||
| Prior Publication US 2006/0266921 A1, Nov. 30, 2006 | ||
| Int. Cl. G01J 3/60 (2006.01); H01J 40/14 (2006.01); H01J 6/16 (2006.01) | ||
| U.S. Cl. 250—226 [250/208.1; 250/216; 250/214.1; 257/257; 257/290] | 18 Claims |

| 1. An image sensor, comprising:
a lens array containing a plurality of microlenses arranged in a two-dimensional matrix;
a color filter array formed underneath the lens array and including a plurality of open window cells and a plurality of color
filter cells, each of said open window cells and color filter cells corresponding to one microlens of the lens array, wherein
each open window cell is adapted to pass red, green and blue lights, while each color filter cell is adapted to pass a predetermined
color light;
a protection layer formed of dielectric material underneath the color filter array; and
a pixel sensor array formed underneath the protection layer and having
a first photosensor for sensing a first light passed through each color filter cell,
a second photosensor formed under the first photosensor for sensing a second light passed through each color filter cell,
a third photosensor for sensing a third light passed through each open window cell, and
a fourth photosensor formed under the third photosensor for sensing a fourth light passed through each open window cell;
wherein the pixel sensor array comprises:
a base substrate formed of P-type semiconductor material;
an epitaxial layer formed of P-type semiconductor on the base substrate;
a first photowell layer having a plurality of first photowell areas formed of N-type semiconductor material at a predetermined
first depth from an upper surface of the epitaxial layer, wherein each of the first photowell areas forms the first photosensor
and the third photosensor via P-N junction with the epitaxial layer; and
a second photowell layer having a plurality of second photowell areas formed of N-type semiconductor material at a predetermined
second depth deeper than the first depth from the upper surface of the epitaxial layer, wherein each of the second photowell
areas overlaps with one of the first photowell areas and forms the second photosensor and the fourth photosensor via P-N junction
with the epitaxial layer.
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