| US 7,348,063 B2 | ||
| Film substrate and its manufacturing method | ||
| Taketoshi Yamada, Hino (Japan); Hiroshi Kita, Hino (Japan); Koichi Saito, Hino (Japan); and Yasushi Okubo, Hino (Japan) | ||
| Assigned to Konica Corporation, Tokyo (Japan) | ||
| Filed on Mar. 30, 2006, as Appl. No. 11/394,009. | ||
| Application 11/394009 is a division of application No. 10/011447, filed on Oct. 22, 2001, granted, now 7,141,304, filed on Nov. 28, 2006. | ||
| Claims priority of application No. 2000-392502 (JP), filed on Dec. 25, 2000. | ||
| Prior Publication US 2006/0167201 A1, Jul. 27, 2006 | ||
| This patent is subject to a terminal disclaimer. | ||
| Int. Cl. B32B 9/02 (2006.01) | ||
| U.S. Cl. 428—447 [428/532; 428/704; 528/26; 528/42; 106/287.13; 106/287.16; 106/170.2; 525/54.21; 525/474; 525/389] | 11 Claims |
| 1. A film substrate having a thickness of 30 to 500 μm, prepared by a process comprising steps of:
a) preparing a mixture solution by mixing an organic polymer, which has water solubility of 0 to 5 g based on 100 g of 25
C water and has acetone solubility of 25 to 100 g based on 100 g of 25° C. acetone, and a reactive metal compound under a
reaction accelerating condition, so as to form a condensation polymer from said reactive metal compound and a polymer hybrid
from said organic polymer and said condensation polymer;
b) casting the mixture solution on a substrate;
c) drying the mixture solution on the substrate to obtain a web; and
d) stretching the web to obtain the film substrate having the thickness of 30 to 500 μm.
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