| US 7,347,963 B2 | ||
| Method of molding resin to protect a resolver winding | ||
| Shinichi Namiki, Tokyo (Japan); and Kazunori Sakamoto, Tokyo (Japan) | ||
| Assigned to Minebea Co., Ltd., Nagano-Ken (Japan) | ||
| Filed on Apr. 16, 2004, as Appl. No. 10/826,135. | ||
| Claims priority of application No. 2003-111477 (JP), filed on Apr. 16, 2003. | ||
| Prior Publication US 2005/0077650 A1, Apr. 14, 2005 | ||
| Int. Cl. H02K 15/00 (2006.01); H02K 15/12 (2006.01) | ||
| U.S. Cl. 264—272.2 [264/272.11; 264/272.15; 264/272.19; 264/275; 29/596; 29/597; 29/598; 425/116; 425/125] | 9 Claims |
| 1. A resin molding method for protecting a winding of a resolver comprising:
providing a first mold member, a second mold member, and a movable part, wherein the movable part is disc shaped and is attached
with multiple pins to a body of the first mold member so that the movable part can be moved in an axial direction with respect
to the mold members;
urging the movable part toward the second mold member with springs such that the movable part is closely engaged with the
second mold member while an annular stator of the resolver is sandwiched between the mold members in a manner such that the
annular stator surrounds the movable part;
injecting a fused resin molding material into a space formed between the first mold member and the second mold member, when
the stator, which includes the winding, is sandwiched between the first mold member and the second mold member to cover the
winding with the molding material;
wherein the method further includes locating the pins within the springs.
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