| US 7,347,950 B2 | ||
| Rigid flexible printed circuit board and method of fabricating same | ||
| Bum Young Myung, Chungcheongnam-do (Korea, Republic of); Dong Kuk Kim, Gyeonggi-do (Korea, Republic of); Young Po Park, Chungcheongnam-do (Korea, Republic of); Young Seok Yoon, Chungcheongnam-do (Korea, Republic of); and Dek Gin Yang, Chungcheongbuk-do (Korea, Republic of) | ||
| Assigned to Samsung Electro-Mechanics, Co., Ltd., Kyunggi-do (Korea, Republic of) | ||
| Filed on Aug. 29, 2005, as Appl. No. 11/214,965. | ||
| Claims priority of application No. 10-2005-0016044 (KR), filed on Feb. 25, 2005; and application No. 10-2005-0055647 (KR), filed on Jun. 27, 2005. | ||
| Prior Publication US 2006/0193970 A1, Aug. 31, 2006 | ||
| Int. Cl. H01B 13/00 (2006.01); H05K 3/02 (2006.01); H05K 3/10 (2006.01) | ||
| U.S. Cl. 216—13 [29/846] | 13 Claims |
| 1. A method of fabricating a rigid flexible printed circuit board, comprising the steps of:
preparing a circuit layer, the circuit layer comprising:
a first insulating layer through which a first window is formed;
an internal circuit pattern which is formed on a side of the first insulating layer having the first window; and
first and second protective films for protecting a portion of the internal circuit pattern formed in the first window;
preparing a second insulating layer through which a second window is formed so as to correspond to the first window;
layering a plurality of circuit layers and a plurality of second insulating layers to form a laminate; and
forming external layers, through which third windows are formed so as to correspond to the first and second windows, on upper
and lower sides of the laminate, each of the external layers comprising:
an external circuit pattern which corresponds to the internal circuit pattern; and
third and fourth protective films which protect a portion of the external circuit pattern formed in each of the third windows,
wherein a portion corresponding to the first, second, and third windows is a flexible portion.
|