| US 7,346,982 B2 | ||
| Method of fabricating printed circuit board having thin core layer | ||
| Chong Ho Kim, Chungcheongbuk-do (Korea, Republic of); Dong Kuk Kim, Kyunggi-do (Korea, Republic of); Hyo Soo Lee, Daejeon (Korea, Republic of); and Young Hwan Shin, Daejeon (Korea, Republic of) | ||
| Assigned to Samsung Electro-Mechanics Co., Ltd., Kyunggi-do (Korea, Republic of) | ||
| Filed on Mar. 22, 2005, as Appl. No. 11/86,642. | ||
| Claims priority of application No. 10-2004-0100585 (KR), filed on Dec. 02, 2004. | ||
| Prior Publication US 2006/0121256 A1, Jun. 08, 2006 | ||
| Int. Cl. H05K 3/02 (2006.01) | ||
| U.S. Cl. 29—847 [29/830; 29/851; 29/852; 156/248; 156/289; 174/255] | 3 Claims |
| 1. A method of fabricating a printed circuit board, comprising the steps of:
preparing a base substrate which comprises a core insulating layer, release films attached to the core insulating layer, insulators
separately formed from the core insulating layer and laminated so as to surround the release film, to form a resulting structure;
and copper foils laminated on upper and lower sides of the resulting structure;
maintaining the core insulating layer planar with the release film and the insulators;
forming the insulators to have the same thickness with that of the release film;
forming solder resists on upper and lower sides of the base substrate to form a resulting base substrate;
laminating circuit layers and insulating layers sequentially on upper and lower sides of the resulting base substrate to form
a resulting substrate;
cutting edge portions of the resulting substrate so as to remove the edge portions which contain the insulators surrounding
the release films;
detaching the release films to divide the resulting substrate into two substrates so the two substrates are separated from
the core insulating layer; and
removing the copper foils from the substrates.
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