| US 7,508,515 B2 | ||
| System and method for manufacturing printed circuit boards employing non-uniformly modified images | ||
| Golan Hanina, Rishon Lezion (Israel); Hanan Gino, Rishon Lezion (Israel); Steffen Ruecker, Groslobichau (Germany); and Ido Ben-Tov, Herut (Israel) | ||
| Assigned to Orbotech Ltd, Yavne (Israel) | ||
| Appl. No. 10/513,058 PCT Filed May 01, 2003, PCT No. PCT/IL03/00356 § 371(c)(1), (2), (4) Date May 19, 2005, PCT Pub. No. WO03/094582, PCT Pub. Date Nov. 13, 2003. |
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| Claims priority of provisional application 60/376874, filed on May 02, 2002. | ||
| Prior Publication US 2005/0213806 A1, Sep. 29, 2005 | ||
| Int. Cl. G01B 11/00 (2006.01); G06K 9/00 (2006.01); B41J 2/47 (2006.01); B41J 2/435 (2006.01); G03F 9/00 (2006.01); G03C 5/00 (2006.01) | ||
| U.S. Cl. 356—401 [382/151; 347/234; 347/248; 430/22; 430/30] | 17 Claims |
| 1. A method for fabricating an electrical circuit, comprising:
sensing an actual location of each of a plurality of alignment targets that are distributed on a plurality of electrical circuit
substrates, thus detecting unintentional distortions;
providing image data of an electrical circuit pattern to be recorded on said substrates;
non-uniformly modifying said image data based on an average of the actual locations of the plurality of alignment targets,
thus creating modified image data; and
recording said electrical circuit pattern on said electrical circuit substrates according to said modified image data, such
that recorded features of the electrical circuit pattern are distorted in accordance with the unintentional distortions.
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