| US 7,508,129 B2 | ||
| Surface mount LED | ||
| Seishi Watanabe, Tokyo (Japan); and Yoshihiro Ogawa, Tokyo (Japan) | ||
| Assigned to Stanley Electric Co., Ltd., Tokyo (Japan) | ||
| Filed on Dec. 28, 2005, as Appl. No. 11/275,352. | ||
| Claims priority of application No. 2005-002705 (JP), filed on Jan. 07, 2005. | ||
| Prior Publication US 2006/0151799 A1, Jul. 13, 2006 | ||
| Int. Cl. H01J 1/62 (2006.01) | ||
| U.S. Cl. 313—506 [313/498] | 21 Claims |
| 1. A surface-mount LED, comprising:
an insulator having a surface and a recess, the recess having a bottom portion and a circumferential portion formed adjacent
the bottom portion;
a plurality of separate circuit patterns adjacent the surface of the insulator;
an LED chip assembly including a top surface facing in a light emitting direction and a bottom surface opposed to the top
surface and located adjacent the bottom portion of the recess provided in the insulator; and
a sealant resin located adjacent the LED for sealing, wherein
at least one of the circuit patterns discontinues at a location between the insulator and the bottom surface of the LED chip
to provide an open area adjacent the bottom portion of the recess.
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