| US 7,508,083 B2 | ||
| Electronic component comprising a semiconductor chip and a plastic housing, and method for producing the same | ||
| Robert-Christian Hagen, Sarching (Germany); and Simon Jerebic, Regensburg (Germany) | ||
| Assigned to Infineon Technologies AG, Munich (Germany) | ||
| Appl. No. 10/548,854 PCT Filed Mar. 09, 2004, PCT No. PCT/DE2004/000461 § 371(c)(1), (2), (4) Date Jul. 11, 2006, PCT Pub. No. WO2004/082018, PCT Pub. Date Sep. 23, 2004. |
||
| Claims priority of application No. 103 10 842 (DE), filed on Mar. 11, 2003. | ||
| Prior Publication US 2006/0255478 A1, Nov. 16, 2006 | ||
| Int. Cl. H01L 23/28 (2006.01); H01L 21/00 (2006.01) | ||
| U.S. Cl. 257—787 [257/620; 257/E23.131; 257/E21.502; 438/126; 438/460] | 25 Claims |
| 1. An electronic component comprising:
a plastic housing made of a plastic molding compound;
a semiconductor chip having an upper side, a rear side and lateral sides, the semiconductor chip being embedded in the plastic
housing configured such that the rear side and the lateral sides of the semiconductor chip are fully surrounded by the plastic
molding compound and such that the upper side is exposed from the plastic molding compound, the lateral sides and the rear
side of the semiconductor chip having at least one anchoring region, by means of which the semiconductor chip is in positive
engagement with the surrounding plastic molding compound.
|