| US 7,508,073 B2 | ||
| Wiring board, semiconductor device using the same, and method for manufacturing wiring board | ||
| Yoshifumi Nakamura, Osaka (Japan); and Nozomi Shimoishizaka, Kyoto (Japan) | ||
| Assigned to Panasonic Corporation, Osaka (Japan) | ||
| Filed on Apr. 10, 2007, as Appl. No. 11/733,566. | ||
| Claims priority of application No. 2006-110023 (JP), filed on Apr. 12, 2006. | ||
| Prior Publication US 2007/0241462 A1, Oct. 18, 2007 | ||
| Int. Cl. H01L 23/48 (2006.01); H01L 23/52 (2006.01) | ||
| U.S. Cl. 257—737 [257/778; 257/E23.021] | 9 Claims |
| 1. A wiring board, comprising: an insulating substrate; a plurality of conductive wirings provided on the insulating substrate
so as to be aligned with a semiconductor mounting region where a semiconductor chip is to be mounted; bump electrodes provided
on the respective conductive wirings; and external connection terminals connected to the conductive wiring so as to be connected
with an external device,
wherein the bump electrodes comprise first bump electrodes for mounting the semiconductor chip and second bump electrodes
for adjusting height of the first bump electrodes,
the first bump electrodes and the second bump electrodes are formed by plating,
at least one of the second bump electrodes is provided at a region of the plurality of conductive wirings outside the semiconductor
mounting region so as to be located between the semiconductor mounting region and the external connection terminals, and
the second bump, electrodes protrude from the surface of the conductive wirings in a height direction of the semiconductor
chip.
|