| US 7,508,067 B2 | ||
| Semiconductor insulation structure | ||
| Hiroaki Arai, Nagoya (Japan); Takahiro Ogawa, Aichi-ken (Japan); and Mitsuhara Inagaki, Nishio (Japan) | ||
| Assigned to Denso Corporation, Kariya (Japan) | ||
| Filed on Oct. 13, 2006, as Appl. No. 11/546,976. | ||
| Claims priority of application No. 2005-298758 (JP), filed on Oct. 13, 2005; and application No. 2005-298759 (JP), filed on Oct. 13, 2005. | ||
| Prior Publication US 2007/0085197 A1, Apr. 19, 2007 | ||
| Int. Cl. H01L 23/34 (2006.01); H01L 23/10 (2006.01) | ||
| U.S. Cl. 257—719 [257/706; 257/713; 257/701; 257/E23.101] | 4 Claims |
| 1. A semiconductor insulation structure comprising:
a semiconductor module incorporating therein a semiconductor element and having one surface serving as a first abutment surface;
an insulation member having one surface held in contact with the first abutment surface of the semiconductor module; and
an electrically conductive structural body having a second abutment surface held in contact with the other surface of the
insulation member so as to sandwich the same between the electrically conductive structural body and the semiconductor module,
wherein the semiconductor module, the insulation member and the electrically conductive structural body are held in a pressured
contact with each other;
wherein one of the first and second abutment surfaces is made of a material to provide a deformation resistant abutment surface
with a less deformation rate in terms of a given load and the other one of the first and second abutment surfaces is made
of a material to provide a readily deforming abutment surface with a greater deformation rate in terms of the given load than
that of the one of the first and second abutment surfaces; and
wherein at least a portion of an outer circumferential periphery of the deformation resistant abutment surface is placed outside
an outer circumferential periphery of the readily deforming abutment surface.
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