| US 7,507,915 B2 | ||
| Stack structure of carrier boards embedded with semiconductor components and method for fabricating the same | ||
| Chia-Wei Chang, Hsin-chu (Taiwan); Lin-Yin Wong, Hsin-chu (Taiwan); Zao-Kuo Lai, Hsin-chu (Taiwan); and Chung-Cheng Lien, Hsin-chu (Taiwan) | ||
| Assigned to Phoenix Precision Technology Corporation, Hsin-Chu (Taiwan) | ||
| Filed on Aug. 04, 2006, as Appl. No. 11/462,604. | ||
| Claims priority of application No. 94136264 A (TW), filed on Oct. 18, 2005. | ||
| Prior Publication US 2007/0084628 A1, Apr. 19, 2007 | ||
| Int. Cl. H05K 1/16 (2006.01) | ||
| U.S. Cl. 174—260 [174/262] | 3 Claims |
| 1. A stack structure of carrier boards embedded with semiconductor components, the stack structure comprising:
a first carrier board and a second carrier board, each of the carrier boards having at least one through hole;
a first semiconductor component and a second semiconductor component installed in the through holes of the first and second
carrier boards respectively, wherein each of the first and second semiconductor components has an active surface and an opposing
non-active surface, the active surface having a plurality of electrode pads;
a dielectric layer formed between the first and second carrier boards and filled in the through holes of the first and second
carrier boards for fixing the first and second semiconductor components to the through holes;
a first circuit build-up structure and a second circuit build-up structure formed on outermost surfaces of the first and second
carrier boards respectively, each of the first and second circuit build-up structures comprising a dielectric layer, a circuit
layer stacked on the dielectric layer, and a conductive structure formed in the dielectric layer for electrically connecting
the circuit layer to the electrode pads of the semiconductor components; and
a plurality of electroplated through holes penetrating the first and second carrier boards, the first and second circuit build-up
structures and the dielectric layer, wherein the electroplated through holes electrically connect the circuit layers of the
first and second circuit build-up structures.
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