US 7,507,783 B2
	Thermally curable middle layer comprising polyhedral oligomeric silsesouioxanes for 193-nm trilayer resist process
Jim D. Meador, Manchester, Mo. (US); Mariya Nagatkina, Buffalo Grove, Ill. (US); and Doug Holmes, Rolla, Mo. (US)
Assigned to Brewer Science Inc., Rolla, Mo. (US)
Filed on Feb. 20, 2004, as Appl. No. 10/784,045.
Claims priority of provisional application 60/449898, filed on Feb. 24, 2003.
Prior Publication US 2004/0229158 A1, Nov. 18, 2004
Int. Cl. C08G 77/06 (2006.01)

U.S. Cl. 528—28  [528/12; 528/21; 528/23; 528/32; 528/37; 526/279; 428/447]

52 Claims

1. In a composition for use in microlithographic processes, wherein the composition comprises an acid and a constituent dissolved or dispersed in a solvent system, said constituent being selected from the group consisting of polymers, compounds, and mixtures thereof, the improvement being that said polymer includes recurring monomers comprising a polyhedral oligomeric silsesquioxane having an alcohol functionality and that said compound comprises a polyhedral oligomeric silsesquioxane having an alcohol functionality, said composition further comprising a cross-linking agent, wherein said composition is non-photoimageable.