| US 7,507,777 B2 | ||
| Press-bonding anisotropic conductive resin composition and elastomeric anisotropic conductor | ||
| Daichi Todoroki, Annaka (Japan); and Tsutomu Nakamura, Annaka (Japan) | ||
| Assigned to Shin-Etsu Chemical Co., Ltd., Tokyo (Japan) | ||
| Filed on Jun. 02, 2006, as Appl. No. 11/445,279. | ||
| Claims priority of application No. 2005-163705 (JP), filed on Jun. 03, 2005. | ||
| Prior Publication US 2006/0276584 A1, Dec. 07, 2006 | ||
| Int. Cl. C08L 83/04 (2006.01); C08G 77/12 (2006.01) | ||
| U.S. Cl. 524—588 [528/31] | 12 Claims |
| 1. A press-bonding anisotropic conductive resin composition comprising
(A) 100 parts by weight of an organopolysiloxane having on the average at least two alkenyl groups per molecule,
(B) 0.1 to 10 parts by weight of an adhesion promoter in the form of a resinous copolymer composed mainly of R3SiO1/2 units and SiO2 units in a molar ratio [R3SiO1/2/SiO2] of from 0.5/1 to 1.5/1, wherein R stands for a substituted or unsubstituted monovalent hydrocarbon group and may or may
not contain alkenyl, with the proviso that when R contains alkenyl, the total amount of alkenyl is not more than 0.00092 mol/g,
(C) 0 to 100 parts by weight of finely divided silica,
(D) 0.1 to 10 parts by weight of metallized conductive particles comprised of core particles which are plated with one or
more metals, the conductive particles having an average particle size of 1 to 50 μm and a true specific gravity of 1 to 5,
and
(E) an addition reaction curing agent consisting of an organohydrogenpolysiloxane in such amount that 50 to 500 mol % of silicon-bonded
hydrogen atoms are available relative to alkenyl groups in the organopolysiloxane (A) and a platinum group catalyst in an
amount of 1 to 2,000 ppm of platinum atoms based on the weight of the organopolysiloxane (A),
said composition becoming an anisotropic conductor by press bonding.
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