US 7,507,467 B2
	Component comprising submicron hollow spaces
Johannes Edlinger, Feldkirch (Austria); Claus Heine-Kempkens, Chur (Germany); and Othmar Züger, Triesen (Liechtenstein)
Assigned to Oerlikon Trading AG, Trubbach, Trubbach (Switzerland)
Filed on Feb. 19, 2008, as Appl. No. 12/33,235.
Application 12/033235 is a division of application No. 11/368813, filed on Mar. 06, 2006, granted, now 7,371,329.
Application 11/368813 is a continuation of application No. 11/104186, filed on Apr. 12, 2005, granted, now 7,026,046, filed on Apr. 11, 2006.
Application 11/104186 is a continuation of application No. 10/366095, filed on Feb. 12, 2003, granted, now 6,884,500, filed on Apr. 26, 2005.
Claims priority of provisional application 60/356284, filed on Feb. 12, 2002.
Prior Publication US 2008/0152892 A1, Jun. 26, 2008
This patent is subject to a terminal disclaimer.
Int. Cl. B32B 5/14 (2006.01); B32B 3/26 (2006.01)

U.S. Cl. 428—310.5  [428/304.4; 428/314.2; 428/314.8; 428/315.7; 428/315.9; 428/457; 428/913]

2 Claims

1. An optical component comprising an array of microstructures provided on a substrate, said microstructures having respective top surfaces and side walls such that adjacent microstructures define microchannels between respective side walls thereof, and a cover material deposited over said microstructures, said cover material covering the top surfaces of two adjacent ones of said microstructures to a first thickness of said cover material and at least partially covering the adjacent side walls of those two microstructures to a second thickness of said cover material, said first thickness being greater than said second thickness, wherein the portions of said covering material covering the top surfaces of said two microstructures extend toward one another over the microchannel defined between said two microstructures.