| US 7,507,144 B2 | ||
| Substrate polishing apparatus | ||
| Kazuto Hirokawa, Tokyo (Japan); Shunsuke Nakai, Tokyo (Japan); Shinrou Ohta, Tokyo (Japan); Yutaka Wada, Tokyo (Japan); and Yoichi Kobayashi, Tokyo (Japan) | ||
| Assigned to Ebara Corporation, Tokyo (Japan) | ||
| Filed on Mar. 28, 2007, as Appl. No. 11/727,727. | ||
| Application 11/727727 is a division of application No. 11/274112, filed on Nov. 16, 2005, granted, now 7,214,122. | ||
| Application 11/274112 is a continuation in part of application No. 10/617794, filed on Jul. 14, 2003, abandoned. | ||
| Application 10/617794 is a continuation in part of application No. PCT/JP2004/006768, filed on May 13, 2004. | ||
| Claims priority of application No. 2003-138479 (JP), filed on May 16, 2003; application No. 2003-138496 (JP), filed on May 16, 2003; and application No. 2003-138782 (JP), filed on May 16, 2003. | ||
| Prior Publication US 2007/0173177 A1, Jul. 26, 2007 | ||
| This patent is subject to a terminal disclaimer. | ||
| Int. Cl. B24B 49/00 (2006.01) | ||
| U.S. Cl. 451—6 [451/10; 451/11; 451/41; 451/287; 156/345.13; 156/345.16] | 16 Claims |
| 1. A substrate polishing apparatus comprising:
a polishing table;
a polishing pad mounted on said polishing table for polishing a semiconductor substrate, said polishing pad having a through
hole formed therein;
a light emission and reception device having an emitter for emitting measurement light through said through hole formed in
said polishing pad to the semiconductor substrate and a receiver for receiving reflected light from the semiconductor substrate
so as to measure a film on the semiconductor substrate, said light emission and reception device being disposed in said polishing
table;
a supply passage for supplying a fluid to a path of the measurement light so as to produce a flow of the fluid from said light
emission and reception device to the semiconductor substrate; and
a discharge passage for discharging the fluid in the path of the measurement light, said discharge passage being provided
in said polishing table and having a fluid connection with said supply passage,
wherein said supply passage has an outlet portion, said outlet portion having a first end disposed within the supply passage
and a second end that terminates within the through hole, and
a portion of said emitter and a portion of said receiver are located within said outlet portion.
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