| US 7,506,548 B2 | ||
| Pressure sensor package structure | ||
| Tetsuya Fukuda, Niigata-ken (Japan); Katsuya Kikuiri, Niigata-ken (Japan); Kiyoshi Sato, Niigata-ken (Japan); Mitsuru Watanabe, Niigata-ken (Japan); and Yoshinobu Nakamura, Niigata-ken (Japan) | ||
| Assigned to Alps Electric Co., Ltd., Tokyo (Japan) | ||
| Filed on Oct. 01, 2007, as Appl. No. 11/865,479. | ||
| Claims priority of application No. 2006-271001 (JP), filed on Oct. 02, 2006. | ||
| Prior Publication US 2008/0078251 A1, Apr. 03, 2008 | ||
| Int. Cl. G01L 7/00 (2006.01) | ||
| U.S. Cl. 73—756 | 8 Claims |
| 1. A pressure sensor package comprising:
a pressure sensor;
a package body having a storage area for storing the pressure sensor;
a lid member which seals the package body in a state in which the pressure sensor is stored in the storage area of the package
body; and
a mount bottom surface on which the pressure sensor is mounted in the storage area,
wherein the mount bottom surface has an opening, an external size of the opening being smaller than an external size of the
pressure sensor, and
wherein the pressure sensor is adhered to the mount bottom surface at least at a corner of the pressure sensor.
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