| US 7,506,450 B2 | ||
| Adhesive mount for a leveling device and a leveling device | ||
| James Spaulding, Bristol, Conn. (US); and John C. Murray, Canton, Conn. (US) | ||
| Assigned to The Stanley Works, New Britain, Conn. (US) | ||
| Filed on Jun. 30, 2006, as Appl. No. 11/477,589. | ||
| Prior Publication US 2008/0000095 A1, Jan. 03, 2008 | ||
| Int. Cl. G01C 15/00 (2006.01); A47G 1/17 (2006.01) | ||
| U.S. Cl. 33—286 [33/281; 33/DIG. 21; 248/205.3] | 24 Claims |
| 1. A mount for removably mounting a device to a reference surface, the mount comprising:
a thermoplastic hot melt adhesive having a first surface and a second surface facing a direction opposite to the first surface,
the first and second surfaces defining a thickness of the adhesive, wherein at least a portion of the adhesive is uninterrupted
through the thickness thereof from the first surface to the second surface; and
a tab that extends from the adhesive,
the adhesive being configured to adhere the first surface to the reference surface and the second surface to the device when
the device is mounted to the reference surface, and to be removed from the reference surface without damaging the reference
surface by moving the tab in a direction substantially parallel to the reference surface.
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