| US 7,503,983 B2 | ||
| Methods of proximity head brushing | ||
| John M. Boyd, Atascadero, Calif. (US); Michael L. Orbock, Beaverton, Oreg. (US); and Fred C. Redeker, Fremont, Calif. (US) | ||
| Assigned to Lam Research Corporation, Fremont, Calif. (US) | ||
| Filed on Jan. 11, 2008, as Appl. No. 12/8,552. | ||
| Application 12/008552 is a division of application No. 10/742303, filed on Dec. 18, 2003, granted, now 7,353,560. | ||
| Prior Publication US 2008/0105277 A1, May 08, 2008 | ||
| Int. Cl. B08B 1/00 (2006.01) | ||
| U.S. Cl. 134—6 [134/15; 134/21; 134/24; 134/26; 134/32; 134/33; 134/34; 134/36; 134/37; 134/42; 134/902; 15/88.2; 15/88.3; 15/88.4] | 17 Claims |
| 1. A method of preparing a wafer surface, comprising the operations of:
providing a brush mounted in a housing, the brush having a surface for scrubbing the wafer surface;
partially surrounding the surface of the brush with a plurality of meniscus-forming ports in the housing;
applying the plurality of meniscus-forming ports proximate to the wafer surface;
scrubbing the wafer surface using the surface of the brush and simultaneously activating the plurality of meniscus-forming
ports to form a meniscus on the wafer surface, wherein the meniscus contains fluids at least partially around the brush; and
scanning the housing relative to the wafer surface so that the brush and the ports move across the wafer surface and the meniscus
dries the wafer surface after the brush scrubs the wafer surface.
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