US 7,503,977 B1
Solidifying layer for wafer cleaning
Robert J. O'Donnell, Fremont, Calif. (US); and Thomas W. Anderson, Hayward, Calif. (US)
Assigned to Lam Research Corporation, Fremont, Calif. (US)
Filed on Sep. 27, 2005, as Appl. No. 11/237,190.
Int. Cl. B05B 7/06 (2006.01); B05B 5/00 (2006.01); B05C 11/10 (2006.01)
U.S. Cl. 118—313  [118/63; 118/642] 6 Claims
OG exemplary drawing
 
1. A substrate preparation system, comprising:
a proximity head having a head surface configured to be positioned near a surface of the substrate, the head surface including a first section and a second section, the first section includes a plurality of inlets for delivering a solution to the surface of the substrate and a plurality of outlets for removing a portion of the solution from the surface of the substrate, the plurality of inlets and the plurality of outlets are defined to maintain a fluid meniscus between the proximity head and the surface of the substrate, the surface of the substrate maintains a remaining portion of the solution as a coherent film after the proximity head scans over the surface of the substrate, and the second section includes a light source that is substantially parallel to the substrate and directed toward the coherent film;
wherein the coherent film is configured to be cured by the light source, the remaining portion of the solution acting on the surface of the substrate and binding particulates present on the surface of the substrate as the coherent film cures.