| US 7,503,689 B2 | ||
| Measuring and trimming circuit components embedded in micro-platforms | ||
| Oleg Grudin, Montreal (Canada); and Leslie M. Landsberger, Westmount (Canada) | ||
| Assigned to Microbridge Technologies Inc., Montrëal, Quëbec (Canada) | ||
| Filed on Jul. 24, 2007, as Appl. No. 11/878,356. | ||
| Application 11/878356 is a continuation of application No. 11/232909, filed on Sep. 23, 2005, granted, now 7,261,461. | ||
| Claims priority of provisional application 60/612156, filed on Sep. 23, 2004. | ||
| Prior Publication US 2007/0263697 A1, Nov. 15, 2007 | ||
| Int. Cl. G01K 15/00 (2006.01); G01K 7/00 (2006.01); H01C 10/00 (2006.01) | ||
| U.S. Cl. 374—1 [374/185; 374/183; 338/195] | 8 Claims |
| 1. A method of compensating for temperature variations in a temperature-sensitive portion of a circuit, the method comprising:
embedding said temperature-sensitive portion of said circuit in a suspended mass of mono-crystalline silicon beneath a thermally-isolated
micro-platform on a substrate;
temperature conditioning said circuit by measuring an output of said circuit while unheated, heating said temperature-sensitive
portion to imitate heating of said circuit, thereby causing temperature variations in said temperature-sensitive portion,
and measuring said output of said circuit during said heating,
determining a temperature drift of said circuit due to said heating;
calculating a desired trim of said circuit to compensate for said temperature drift; and
trimming a part of said circuit.
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